发明名称 Integrated circuits and methods of designing the same
摘要 A method of designing an integrated circuit includes deploying an active area in a first standard cell. At least one gate electrode is routed, overlapping the active area in the first standard cell. At least one metallic line structure is routed, overlapping the active area in the first standard cell. The at least one metallic line structure is substantially parallel to the gate electrode. A first power rail is routed substantially orthogonal to the at least one metallic line structure in the first standard cell. The first power rail overlaps the at least one metallic line structure. The first power rail has a flat edge that is adjacent to the at least one metallic line structure. A first connection plug is deployed at a region where the first power rail overlaps the at least one metallic line structure in the first standard cell.
申请公布号 US8607172(B2) 申请公布日期 2013.12.10
申请号 US201113267310 申请日期 2011.10.06
申请人 LU LEE-CHUNG;TIEN LI-CHUN;ZHUANG HUI-ZHONG;HUANG MEI-HUI;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 LU LEE-CHUNG;TIEN LI-CHUN;ZHUANG HUI-ZHONG;HUANG MEI-HUI
分类号 G06F17/50 主分类号 G06F17/50
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