| 摘要 |
PROBLEM TO BE SOLVED: To provide a radiation curable adhesive tape for semiconductor processing, having excellent antistatic performance, capable of suppressing die fly generation, and excellent in pickup properties, in a semiconductor device processing process.SOLUTION: A radiation curable adhesive tape for semiconductor processing has an adhesive layer on at least one surface of a base material resin film. The adhesive layer contains a base polymer, a radiation curable compound having an ethylenic unsaturated bond and an ionic liquid, a content of the radiation curable compound is 5-150 pts.mass per 100 pts.mass of the base polymer, and the content of the ionic liquid is 3-23 pts.mass per 100 pts.mass of the total of the base polymer and the radiation curable compound. |
