| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-packaged semiconductor light-emitting device comprising ESD protection means.SOLUTION: A semiconductor light-emitting device according to an embodiment comprises: a semiconductor layer including a first surface, a second surface opposite thereto, and a light-emitting layer; a p-side electrode provided on the second surface; and an n-side electrode. The semiconductor light-emitting device further comprises: a first insulating film provided on a side of the second surface; a p-side wiring part provided on the first insulating film and electrically connected to the p-side electrode; and an n-side wiring part provided on the first insulating film so as to be apart from the p-side wiring part and electrically connected to the n-side electrode. A gap between a tip of a first projection provided at the p-side wiring part toward the n-side wiring part and a tip of a second projection provided at the n-side wiring part toward the p-side wiring part is the minimum gap between the p-side wiring part and the n-side wiring part. |
