| 摘要 |
<p>An electronic component testing device (1) comprising: a housing unit (10) whereby, after an empty test carrier (80) is dismantled, an untested die (90) is housed inside the test carrier (80) and the test carrier (80) is assembled; a test unit (20) that tests the die (90) housed in the test carrier (80); and a retrieval unit (30) whereby, after the test carrier (80) is dismantled and the tested die (90) has been retrieved from the test carrier (80), the empty test carrier (80) is reassembled.</p> |
