| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board having high reliability, and a method of manufacturing the same.SOLUTION: The wiring board includes: an interlayer resin insulating layer 26a; a column electrode 36c formed on the interlayer resin insulating layer; a sub wiring board 10 which is disposed on the interlayer resin insulating layer and has an insulating layer 120 and a conductor pattern 111 on this insulating layer; and a solder resist layer 40a which is provided so as to cover the upper side of the interlayer resin insulating layer, the upper side of the column electrode, and the sub wiring board and has openings for at least partially opening the column electrode and the conductor pattern. |
