| 摘要 |
PROBLEM TO BE SOLVED: To provide an organic semiconductor element encapsulation body which optimizes an encapsulation structure of an organic semiconductor element by controlling outflow of a sealing material in thermocompression.SOLUTION: An organic semiconductor element encapsulation body comprises: an organic semiconductor element 12 composed of a laminate including a pair of electrode layers 12a and 12c, and an organic semiconductor layer 12b arranged between the pair of electrode layers 12a and 12c; a transparent substrate 14; and an encapsulation film material 16 for encapsulating the organic semiconductor element 12 with the transparent substrate 14. The encapsulation film material 16 and the transparent substrate 14 encapsulate the organic semiconductor element 12 sandwiching it from both sides and thermally compress it on the peripheral part with a thermally adhesive sealing material 18. The thermally adhesive sealing material 18 includes a cross-linked thermoplastic resin and has a melt flow rate, measured with reference to JIS K 7210 at 250°C and weight of 2.16 kg, in a range of 0.1-5 g/10 min. |
