LED MODULE AND PRODUCTION METHOD THEREFOR, LIGHTING DEVICE

摘要

An LED module is provided with a sub-mount member, an LED chip that is joined via a first joining section to one surface side of the sub-mount member in the thickness direction, and a wiring pattern to which the LED chip is electrically connected. The first joining section is configured so as to allow light emitted from the LED chip to pass therethrough. The sub-mount member is a translucent member having light diffusing properties. The planar size of the sub-mount member is larger than the planar size of the LED chip. The wiring pattern is provided so as to avoid the LED chip at one surface of the sub-mount member. The sub-mount member comprises a plurality of translucent layers that are stacked in the thickness direction. The optical characteristics of each translucent layer differ from those of the other translucent layers, and the further a translucent layer is from the LED chip, the higher is the reflectance occurring in the wavelength region of the light that is emitted from the LED chip. Also provided is a lighting device comprising the LED module as a light source.