发明名称 |
PRINTED CIRCUIT BOARD ASSEMBLY |
摘要 |
The present invention relates to a printed circuit board assembly (10), said printed circuit board assembly comprising: a substrate (100); two or more electronic components which are categorized, wherein each component is secured to the substrate by securing means having a different predetermined thermal-release temperature, depending on which category said component belongs to. The invention furthermore relates to a method of assembling the printed circuit board assembly and a method of disassembling the printed circuit board assembly according to the invention. |
申请公布号 |
EP2668834(A1) |
申请公布日期 |
2013.12.04 |
申请号 |
EP20120706112 |
申请日期 |
2012.01.30 |
申请人 |
KONINKLIJKE PHILIPS N.V. |
发明人 |
JI, HANGFENG;BALKENENDE, ABRAHAM, RUDOLF;CHEN, HONG |
分类号 |
H05K1/02;H05K3/22;H05K3/30;H05K3/32;H05K3/34 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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