| 摘要 |
A Fe-Pt-Ag-C-based sintered sputtering target having a composition represented by the formula (Fe100-X-PtX)100-Y-Z-AgY-CZ (wherein X represents a numerical value fulfilling the formula 35 <= X <= 55; Y represents a numerical value fulfilling the formula 0.5 <= Y <= 15; and Z represents a numerical value fulfilling the formula 15 <= Z <= 55) when expressed in an atomic ratio, and also having a relative density of 93% or more. A method for producing a Fe-Pt-Ag-C-based sintered sputtering target, characterized by comprising producing a Fe-Pt-C sintered body in advance, pulverizing the sintered body to produce a pulverized powder, mixing the pulverized powder with an Ag powder, and sintering the resultant mixture at a temperature lower than the melting point of Ag. The purpose of the present invention is to provide a high-density sputtering target which enables the production of a magnetic thin film having a granular structure without using an expensive co-sputtering device and which generates a reduced amount of particles during sputtering. |
