发明名称 SOLUTION SUPPLY PIPING OF ELECTROLYTIC SOLUTION
摘要 PROBLEM TO BE SOLVED: To provide a solution supply piping of an electrolytic solution, capable of removing bubbles mixed in the electrolytic solution.SOLUTION: A solution supply piping 1 is for supplying an electrolytic solution to an electrolytic cell 2, and is provided with a bubble discharge hole 13 formed for discharging bubbles surfacing from the electrolytic solution inside the solution supply piping 1 to the outside of the solution supply piping 1. A bubble discharge pipe 14 whose one end is connected to the bubble discharge hole 13 is provided, and an opening end 14a of the bubble discharge pipe 14 is led to the electrolytic cell 2 or an electrolytic solution discharge part 3. Since the bubbles surfacing from the electrolytic solution inside the solution supply piping 1 can be discharged from the bubble discharge hole 13, the bubbles mixed in the electrolytic solution can be removed. Thus, generation of a pinhole can be suppressed. By leading the electrolytic solution that leaks out from the bubble discharge hole 13 to the electrolytic cell 2 or the electrolytic solution discharge part 3, the electrolytic solution can be recovered.
申请公布号 JP2013237921(A) 申请公布日期 2013.11.28
申请号 JP20120113241 申请日期 2012.05.17
申请人 SUMITOMO METAL MINING CO LTD 发明人 KASHU HIROHISA
分类号 C25C7/00;C25C7/06 主分类号 C25C7/00
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