发明名称 |
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME |
摘要 |
A method of manufacturing a printed circuit board (PCB) and the PCB are provided. The method includes: filling a resin in a via-hole formed at a substrate from one surface side of the substrate; emitting light for a predetermined period of time to the resin filled in the via-hole from the other surface side of the substrate; and applying another resin on the other surface of the substrate.
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申请公布号 |
US2013313009(A1) |
申请公布日期 |
2013.11.28 |
申请号 |
US201213603959 |
申请日期 |
2012.09.05 |
申请人 |
SEOL JEONG-HOON;JUNG YOUN-KWON;KIM SANG-KUN;SAMSUNG TECHWIN CO., LTD. |
发明人 |
SEOL JEONG-HOON;JUNG YOUN-KWON;KIM SANG-KUN |
分类号 |
B29C71/04;H05K1/11 |
主分类号 |
B29C71/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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