| 摘要 |
The project of the present invention is that of an entire surface of a substrate which is equally and efficiently washed even though it is a substrate having a hydrophobic property and a large caliber and corrosion caused by touching copper used for metal wiring is maximally prevented using a relatively simple structure. A processing chamber (40) including a substrate return unit (30) slides, returning the substrate and maintaining the horizontal of the substrate, washing units (50, 52) washing a surface of the substrate without touching by supplying a washing solution to the surface of the substrate moving in the processing chamber, and inactivity gas discharging units (64, 66) making an inactivity gas atmosphere in the processing chamber while drying the substrate with inactivity gas by discharging the inactivity gas to both sides of the washed substrate. |
