MOLDING PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a molding package and a manufacturing method thereof and particularly to the molding package capable of preventing the movement of a chip in molding and the manufacturing method thereof. The price of a package is reduced by manufacturing the molding package without a tuposuser. To obtain a small and thin package, a plating process and a via process for connecting a chip to a substrate instead of connecting the chip and the substrate after the molding in an existing chip embedded type molding package are omitted and A molding is carried out after the chip and the substrate is connected to a metal in advance. Therefore, bad contact due to the movement of the chip is reduced. [Reference numerals] (AA) Start;(BB) End;(S310) Step of producing a molding die;(S320) Step of producing a molding carrier;(S330) Step of separating the molding die form the molding carrier;(S340) Step of inserting a chip;(S350) Step of forming patterns