FACE DOWN TYPE IMAGE SENSOR PACKAGE AND METHOD FOR FABRICATING THE SAME

摘要

The present invention provides an image sensor package and a manufacturing method thereof, capable of forming an ultra thin image sensor package by locating an image sensing area on a side which is opposite to an image input side by an image projection phenomenon in the image sensing area by passing an image through image sensor silicon and improving productivity by manufacturing processes in a wafer level. The prevent invention includes: a substrate on which an electric circuit pattern is formed; and an image sensor which is formed on the upper surface of the substrate by electrically connecting a bonding pad to a lead pad which is formed on the upper surface of the substrate and includes the image sensing area for sensing the image which faces the upper surface of the substrate.