发明名称 Encapsulating sheet, producing method thereof, light emitting diode device, and producing method thereof
摘要 <p>An encapsulating sheet (1) includes an encapsulating layer (2) for encapsulating a light emitting diode element (12), a light scattering layer (3) formed at one side in a thickness direction of the encapsulating layer (2) and for scattering light emitted from the light emitting diode element (12), and a spacer layer (4) interposed between the encapsulating layer (2) and the light scattering layer (3). The encapsulating sheet (1) may further include a phosphor layer (5) interposed between the encapsulating layer (2) and the spacer layer (4).</p>
申请公布号 EP2571067(A3) 申请公布日期 2013.11.20
申请号 EP20120184062 申请日期 2012.09.12
申请人 NITTO DENKO CORPORATION 发明人 KONDO, TAKASHI;MATSUDA, HIROKAZU;KONO, HIROKI
分类号 H01L33/52;H01L25/075;H01L33/50;H01L33/56 主分类号 H01L33/52
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