发明名称 |
Stacked semiconductor chips having circuit element provided with each of the semiconductor chips |
摘要 |
A stacked device includes a plurality of semiconductor chips connected to each other by through electrodes. The same number of through electrodes are included in each of paths extending from a first power source terminal through each of circuit elements formed for the semiconductor chips to a second power source terminal.
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申请公布号 |
US8587117(B2) |
申请公布日期 |
2013.11.19 |
申请号 |
US201213455171 |
申请日期 |
2012.04.25 |
申请人 |
TAKAYAMA SHINICHI;ONO KAZUO;SEKIGUCHI TOMONORI;KOTABE AKIRA;YANAGAWA YOSHIMITSU;ELPIDA MEMORY, INC. |
发明人 |
TAKAYAMA SHINICHI;ONO KAZUO;SEKIGUCHI TOMONORI;KOTABE AKIRA;YANAGAWA YOSHIMITSU |
分类号 |
H01L23/34 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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