| 摘要 |
<p>Provided is a photosensitive resin composition which has excellent resolution and adhesion as a resist material for an etching resist, a plating resist or the like. This photosensitive resin composition contains 20-90% by weight of a binder polymer (A), 5-75% by weight of a photopolymerizable compound (B) and 0.01-30% by weight of a photopolymerization initiator (C). The photosensitive resin composition is characterized in that: the binder polymer (A) is a copolymer which is obtained by copolymerizing a first monomer that is a carboxylic acid or a carboxylic acid anhydride and a non-acidic second monomer that contains one polymerizable unsaturated group, said copolymer having a weight average molecular weight of 5,000-100,000; the photopolymerizable compound (B) is an addition-polymerizable monomer; and a photosensitive resin layer, which is obtained by exposing the photosensitive resin composition and then developing the exposed photosensitive resin composition, has a water contact angle of more than 60° and a Young's modulus of 1.5 GPa or more but less than 4 GPa.</p> |
