CONTACT PIN, AND THE SOCKET FOR TEST OF SEMICONDUCTOR PACKAGE COMPRISING THE SAME

摘要

The present invention provides a multi-contact contact pin for a semiconductor package socket and a socket for mounting a semiconductor package including the same. The multi-contact contact pin for a semiconductor package socket comprises a triangular contact part which is mounted in a semiconductor package socket and makes an interface with a semiconductor package terminal; an upper terminal which consists of contact units composed of support plates extended to the lower part of the contact part and is connected by a bent part to make the contact units compose the side of a triangular pillar; an elastic part which is extended to the lower end of one contact unit and to the lower part; and a pin leg part which is extended from one lower side of the elastic part to the lower part. [Reference numerals] (AA) Front view;(BB) Rear view