| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder mounting board excellent in mounting reliability of components, a method for manufacturing the same, and a semiconductor device.SOLUTION: The solder mounting board includes a substrate 1, and wiring on at least one surface of the substrate 1, a solder pad 2 on which a component is mounted via a solder, and an insulating layer exposing at least the solder pad 2 and covering the wiring. The insulating layer comprises a first insulating layer 4 provided on the substrate and the wiring, and a second insulating layer 5 provided on at least part of the first insulating layer 4. |
