RESIST UNDERLAYER FILM-FORMING COMPOSITION

摘要

[Problem] To provide a composition for forming a resist underlayer film that has improved adhesion to a resist pattern. [Solution] A resist underlayer film-forming composition for lithography, which contains an organic solvent and a polymer that has a structure represented by formula (1a), formula (1b) or formula (2) at an end. (In the formulae, R1 represents a hydrogen atom or a methyl group; each of R2 and R3 independently represents a hydrogen atom or an organic group such as a hydrocarbon group, and the hydrocarbon may have a hydroxy group and/or a methylthio group as a substituent; R4 represents a hydrogen atom or a hydroxy group; Q1 represents an arylene group; v represents 0 or 1; y represents an integer of 1-4; w represents an integer of 1-4; x1 represents 0 or 1; and x2 represents an integer of 1-5.)