发明名称 ELECTRONIC CIRCUIT PACKAGE
摘要 PROBLEM TO BE SOLVED: To provide an electronic circuit package which enables versatile lead free solder to be used and unfailingly prevents the occurence of solder flashing.SOLUTION: In an electronic circuit package 100, an electrode 110a of an electronic component 110 and a wiring part 130 are resin sealed while being joined to each other by solder 120. An air gap 150, which is used for flowing a part of the melted soler in a joined part between the electrode 110a of the electronic component 110 and the wiring part 130 when the electrode 110a of the electronic component 110 and the wiring part 130 are joined to each other by the solder, is formed in the wiring part 130.
申请公布号 JP2013232566(A) 申请公布日期 2013.11.14
申请号 JP20120104245 申请日期 2012.04.28
申请人 SHINDENGEN ELECTRIC MFG CO LTD 发明人 FUNAKOSHI SHICHIRO;MATSUZAKI OSAMU
分类号 H01L21/52;H01L21/60 主分类号 H01L21/52
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