| 摘要 |
PROBLEM TO BE SOLVED: To appropriately and efficiently perform bond between substrates, while suppressing occurrence of voids between the substrates.SOLUTION: A conveyance region T1 and a processing region T2 are formed in a bonding apparatus 41. The conveyance region T1 comprises: a wafer conveying body 82 for conveying wafers Wand W, and a superposed wafer W; a position adjustment mechanism 90 for adjusting orientation of a horizontal direction of the wafers Wand W; and an inverting mechanism 130 for inverting front and rear surfaces of the upper wafer W. The processing region T2 comprises: a lower chuck 100 for placing the lower wafer Won an upper surface for holding; an upper chuck 101 for holding the upper wafer Won a lower surface; and a pressing member 120 for allowing one place of the lower wafer Wto abut on one place of the upper wafer Wfor pressing when the wafers Wand Ware bonded. |
