发明名称 |
ELECTRONIC ASSEMBLY WITH IMPROVED THERMAL MANAGEMENT |
摘要 |
<p>An electronic assembly includes a leadframe (2), a semiconductor component (3), and an electrically conductive connecting element (4) made of a composite material (5). The connecting element (4) has a solderable metallization (6) on the composite material (5) on a surface that is directed towards the semiconductor component (3). A thermal conductivity of the composite material (5) of the connecting element (4) is greater than a thermal conductivity of the semiconductor component (3) and less than a thermal conductivity of the leadframe (2). The connecting element (4) is provided only locally in the region of the semiconductor component (3).</p> |
申请公布号 |
EP2661770(A1) |
申请公布日期 |
2013.11.13 |
申请号 |
EP20110790899 |
申请日期 |
2011.11.11 |
申请人 |
ROBERT BOSCH GMBH |
发明人 |
GUGEL, DENIS;SUENNER, THOMAS;KADEN, THOMAS;LEHTONEN, PAEIVI;BEHRENS, TIM |
分类号 |
H01L23/433;H01L23/495 |
主分类号 |
H01L23/433 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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