FLOW SENSOR

摘要

The flow sensor has a sensor element (2) connected with a fixed, electrical conductive carrier part over electrical conductive connections. The sensor element comprises a plate-like carrier substrate on which a temperature sensor and a heating element are arranged. A stable encapsulation (3) partially surrounds the sensor element and the carrier part in a form-fit manner. Regions on an upper side and a lower side of the sensor element are not covered by the encapsulation and circulated by a to-be measured stream (S). The encapsulation is formed of filled epoxy material. The electrical conductive connections are formed as bond connections. The carrier substrate is made of glass, zirconium oxide and low temperature cofired ceramics.