EPOXY RESIN COMPOSITION, SEMI-CURED EPOXY RESIN COMPOSITION, CURED EPOXY RESIN COMPOSITION, RESIN SHEET, PREPREG, LAMINATE, METAL SUBSTRATE, AND PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition capable of satisfying both high heat conductivity and low melting point, and a semi-cured epoxy resin composition, cured epoxy resin composition, resin sheet, prepreg, laminate, metal substrate and printed wiring board by using the same.SOLUTION: An epoxy resin composition includes ≥2 kinds of epoxy resin monomers having a ≥25°C absolute value of the difference of a temperature in transferring from a crystal phase to a liquid crystal phase and a temperature in transferring from the liquid crystal phase to an isotropic phase, a curing agent, and an inorganic filler.