Disclosed herein are adhesive compositions comprising (a) a first component; (b) a second component that chemically reacts with said first component; and (c) graphenic carbon particles having a compressed density of 0.9 or less. Disclosed herein are associated methods for forming the adhesive compositions and applying the adhesive compositions to a substrate to form a bonded substrate.
申请公布号
CA2872477(A1)
申请公布日期
2013.11.07
申请号
CA20132872477
申请日期
2013.05.03
申请人
PPG INDUSTRIES OHIO, INC.
发明人
ASAY, DAVID B.;CHAO, TIEN-CHIEH;DESAI, UMESH C.;HUNG, CHENG-HUNG;NAKAJIMA, MASAYUKI;VANIER, NOEL R.