发明名称 |
INTEGRATED POWER CONVERTER PACKAGE WITH DIE STACKING |
摘要 |
An integrated circuit for implementing a switch-mode power converter is disclosed. The integrated circuit comprises at least a first semiconductor die having an electrically quiet surface, a second semiconductor die for controlling the operation of said first semiconductor die stacked on said first semiconductor die having said electrically quiet surface and a lead frame structure for supporting said first semiconductor die and electrically coupling said first and second semiconductor dies to external circuitry.
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申请公布号 |
US2013292814(A1) |
申请公布日期 |
2013.11.07 |
申请号 |
US201313890662 |
申请日期 |
2013.05.09 |
申请人 |
YANG ERIC;ZHOU JINGHAI;JIANG HUNT HANG |
发明人 |
YANG ERIC;ZHOU JINGHAI;JIANG HUNT HANG |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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