发明名称 |
CONNECTION OF A CHIP PROVIDED WITH THROUGH VIAS |
摘要 |
A chip provided with through vias wherein the vias are formed of an opening with insulated walls coated with a conductive material and filled with an easily deformable insulating material, elements of connection to another chip being arranged in front of the easily deformable insulating material. |
申请公布号 |
US2013292824(A1) |
申请公布日期 |
2013.11.07 |
申请号 |
US201313873103 |
申请日期 |
2013.04.29 |
申请人 |
STMICROELECTRONICS SA |
发明人 |
JOBLOT SYLVAIN;BAR PIERRE |
分类号 |
H01L23/28;H01L21/768;H01L23/538 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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