| 摘要 |
A polyimide resin and a polyimide film are provided to ensure excellent mechanical property and thermal stability by using a copolymer 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropanedianhydride, 4,4'-bis(4-aminophenoxy)diphenylsulfone, and 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane. A polyimide resin comprises the repeating units of the following chemical formula 1a and 1b and has the inherent viscosity of 0.5~0.7 dl/g. The polyimide resin is prepared by the steps of: obtaining polyamic acid solution by reacting 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropanedianhydride, 4,4'-bis(4-aminophenoxy)diphenylsulfone and 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane in the organic solvent; and obtaining a polyimide film by casting the prepared polyamic acid solution and heat-treating the glass plate. The polyimide film has the L-value of color coordinate of 85 or more and the b value of 15 or less. |
