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发明名称
Apparatus for molding semiconductor devices
摘要
申请公布号
KR20130006380(U)
申请公布日期
2013.11.05
申请号
KR20120003423U
申请日期
2012.04.26
申请人
发明人
分类号
H01L21/56
主分类号
H01L21/56
代理机构
代理人
主权项
地址
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