发明名称 Surface treating method and film depositing method
摘要 A surface treating method for treating a surface of a substrate inside a process chamber includes the steps of generating an atmosphere containing no moisture in the process chamber, heating the substrate inside the atmosphere containing no moisture in the process chamber; and causing a reaction between the substrate and an adhesion accelerating agent by feeding the adhesion accelerating agent gas into the process chamber.
申请公布号 US8575039(B2) 申请公布日期 2013.11.05
申请号 US201213425514 申请日期 2012.03.21
申请人 YAMAGUCHI TATSUYA;HASHIMOTO HIROYUKI;TOKYO ELECTRON LIMITED 发明人 YAMAGUCHI TATSUYA;HASHIMOTO HIROYUKI
分类号 H01L21/312 主分类号 H01L21/312
代理机构 代理人
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