发明名称 Polymer composition for microelectronic assembly
摘要 Embodiments in accordance with the present invention encompass polymer compositions that act as both a tack agent and a fluxing agent for the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions embodiments encompass a sacrificial polymer, a carrier solvent, a thermal acid generator and, optionally, formic acid.
申请公布号 US8575248(B2) 申请公布日期 2013.11.05
申请号 US201113204036 申请日期 2011.08.05
申请人 APANIUS CHRISTOPHER;BELL ANDREW;LANGSDORF LEAH;TSANG W. C. PETER;PROMERUS, LLC 发明人 APANIUS CHRISTOPHER;BELL ANDREW;LANGSDORF LEAH;TSANG W. C. PETER
分类号 C08K5/42;B23K20/24;B23K35/36;C08K5/55 主分类号 C08K5/42
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