| 摘要 |
A semiconductor device has an insulation substrate formed with a conductive pattern; an independent terminal, which is an externally leading terminal, soldered to the conductive pattern of the insulation substrate; a case disposed over the insulation substrate such that a top surface of the independent terminal is exposed; an opening provided on a side surface of the case; a nut glove inserted from the opening so as to be below the independent terminal, and fix the independent terminal; and a first projection part formed on a side surface of the nut glove, and having tapers in a frontward direction and a rearward direction of insertion of the nut glove, respectively. The rearward taper of the first projection part is pressure contacting with a sidewall surface of the opening.
|
