ADHESIVE TAPE FOR SEMICONDUCTOR WAFER SURFACE PROTECTION

摘要

PROBLEM TO BE SOLVED: To provide an adhesive tape for semiconductor wafer surface protection which can be formed into a thin film wafer with a thickness of 100 μm or less without intrusion of dust and/or water even when the rear face of a semiconductor wafer is ground while being adhered with a tape, and can be used in an etching step while being adhered with the tape.SOLUTION: The adhesive tape for semiconductor wafer surface protection has an adhesive layer on a base material film. The base material film has a total thickness of 50 to 200 μm. A ratio of the thickness of a high elastic modulus layer to the thickness of a low elastic modulus layer is 1:9 to 5:5. The high elastic modulus layer is arranged on the back face of the adhesive layer, and is a layer which is formed of polypropylene or straight-chain polyethylene and has a thickness of 10 μm or more. The low elastic modulus layer is formed of an ethylene-vinyl acetate copolymer which has a vinyl acetate content of 5 to 20 mass% and an MFR of 0.8 to 10 g/10 min. The thickness of the adhesive layer is 10 μm to 50 μm. Any one of an adhesive force when an adherent is heated and peeled to an SUS280 polished surface at 50°C and an adhesive force after the adherent has been irradiated with ultraviolet rays of 500 mJ is 1.0 N/25 mm or less, and an adhesive force when the adherent is unheated or unirradiated with ultraviolet rays is 50% or less.