发明名称 SENSOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a sensor device which prevents corrosion of a sensor chip and a lead, and a method for manufacturing the same.SOLUTION: There is provided a sensor device which comprises: a sensor part (10) having a sensor chip (11), a lead (12) and a mold resin (13); and a housing (30) in which the sensor part is fixed in a hollow, wherein the mold resin comprises: a first exposed face where the sensor chip is exposed; a second exposed face (13b) where the lead is exposed; and a connection surface (13c) for connecting the first exposed face and the second exposed face, the connection surface is brought into contact with an inner ring surface of the housing to divide the hollow into a first region and a second region, a groove part (73) is formed by the inner ring surface and the first exposed part, and a first boundary line (71) formed in a boundary between the surface of the sensor chip and the first exposed face and a second boundary line (72) formed in a boundary between the first exposed face and the inner ring surface are covered by an adhesive (70) filled in the groove part.
申请公布号 JP2013224908(A) 申请公布日期 2013.10.31
申请号 JP20120098155 申请日期 2012.04.23
申请人 DENSO CORP 发明人 YOSHIDA NORIFUMI;YAMAGUCHI KOHEI
分类号 G01L19/06 主分类号 G01L19/06
代理机构 代理人
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