PROCESS FOR LASER-DRILLING BLIND VIAS

摘要

PROBLEM TO BE SOLVED: To provide a process for laser-forming blind vias in at least one layer of a circuit substrate having a plurality of capture pads of varying geometry.SOLUTION: A method for laser-forming a blind via comprises, for at least one blind via to be formed in at least one layer of a circuit substrate, evaluating a capture pad geometry value (such as the area and/or the volume) within a predetermined distance from a drilling location with respect to a blind via geometry value (such as the area and/or the volume) to be formed at the drilling location. The method also includes setting at least one laser operating parameter on the basis of the evaluation in order to obtain a desired capture pad appearance after the blind via formation.