| 摘要 |
PROBLEM TO BE SOLVED: To reduce crosstalk noise occurring between signal wiring lines.SOLUTION: In a first conductor layer 101, first and second signal wiring patterns 111 and 112 are formed. In a second conductor layer 102 that is a surface layer, a first pad 121 electrically connected to the first signal wiring pattern 111 through the first via 131 and a second pad 122 electrically connected to the second signal wiring pattern 112 through a second via 132 are formed. A third conductor layer 103 is disposed between the first conductor layer 101 and the second conductor layer 102, and an insulator 105 is interposed among the conductor layers. In the third conductor layer 103, a first via pad 141 electrically connected to the first via 131 is formed. The first via pad 141 is overlapped with the second pad 122 as viewed from a direction perpendicular to a substrate surface 100a, and has a facing portion 141a that faces the second pad 122 via the insulator 105. |
