发明名称 Light emitting module
摘要 <p>According to one embodiment, a light emitting module includes a mounting substrate, a plurality of light emitting chips, a transparent layer, and a phosphor layer. The transparent layer is provided between the plurality of light emitting chips on the mounting face and on the light emitting chip. The transparent layer has a first transparent body and a scattering agent dispersed at least in the first transparent body between the plurality of light emitting chips. The scattering agent has a different refraction index from a refraction index of the first transparent body. The phosphor layer is provided on the transparent layer. The light emitting chip includes a semiconductor layer, a p-side electrode, an n-side electrode, a p-side external terminal, and an n-side external terminal.</p>
申请公布号 EP2657967(A2) 申请公布日期 2013.10.30
申请号 EP20120182377 申请日期 2012.08.30
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 KOJIMA, AKIHIRO;FURUYAMA, HIDETO;SHIMADA, MIYOKO;AKIMOTO, YOSUKE;TOMIZAWA, HIDEYUKI
分类号 H01L25/075;H01L33/50 主分类号 H01L25/075
代理机构 代理人
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