发明名称 |
Method for packaging light emitting diode |
摘要 |
A method of packaging a light emitting diode comprising: providing a flexible substrate with a heat-conducting layer, an insulating layer covering on a surface of the heat-conducting layer and an electrically conductive layer positioned on the insulating layer; etching the conductive layer to form a gap in the conductive layer and expose a part of the insulating layer, the conductive layer being separated by the gap into a first electrode and a second electrode isolated from each other; stamping the flexible substrate with a mold at the position of the gap to form a recess in the flexible substrate; positioning a light emitting element on the conductive layer and electrically connecting the light emitting element to the conductive layer; and forming an encapsulation to cover the light emitting element.
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申请公布号 |
US8569080(B2) |
申请公布日期 |
2013.10.29 |
申请号 |
US201213523878 |
申请日期 |
2012.06.14 |
申请人 |
CHEN LI-HSIANG;LIN HSIN-CHIANG;CHEN PIN-CHUAN;ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. |
发明人 |
CHEN LI-HSIANG;LIN HSIN-CHIANG;CHEN PIN-CHUAN |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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