发明名称 PACKAGE AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a package excellent in heat dissipation.SOLUTION: A package 10 has a first electrode 30 formed in a flat plate shape. A lower surface 32 of the first electrode 30 is formed substantially flush with a lower surface 21 of a housing 20 and is exposed from the lower surface 21 of the housing 20. A light-emitting element is connected to an upper surface 31 of the first electrode 30.
申请公布号 JP2013222931(A) 申请公布日期 2013.10.28
申请号 JP20120095488 申请日期 2012.04.19
申请人 SHINKO ELECTRIC IND CO LTD 发明人 OKABE TOSHIYUKI;KOBAYASHI TAKESHI;KOBAYASHI TOSHIO;KIMURA YASUYUKI
分类号 H01L33/64 主分类号 H01L33/64
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