发明名称 |
PACKAGE AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a package excellent in heat dissipation.SOLUTION: A package 10 has a first electrode 30 formed in a flat plate shape. A lower surface 32 of the first electrode 30 is formed substantially flush with a lower surface 21 of a housing 20 and is exposed from the lower surface 21 of the housing 20. A light-emitting element is connected to an upper surface 31 of the first electrode 30. |
申请公布号 |
JP2013222931(A) |
申请公布日期 |
2013.10.28 |
申请号 |
JP20120095488 |
申请日期 |
2012.04.19 |
申请人 |
SHINKO ELECTRIC IND CO LTD |
发明人 |
OKABE TOSHIYUKI;KOBAYASHI TAKESHI;KOBAYASHI TOSHIO;KIMURA YASUYUKI |
分类号 |
H01L33/64 |
主分类号 |
H01L33/64 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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