| 摘要 |
Three-dimensional (3-D) processor devices are provided, which are constructed by connecting processors in a stacked configuration. For instance, a semiconductor device includes a first processor chip comprising one or more processors, a second processor chip comprising one or more processors, and a plurality of input/output ports. The first and second processor chips are connected in a stacked configuration and commonly share the plurality of input/output ports. Methods are also provided to selectively operate the semiconductor device in one of a plurality of operating modes to control power of the semiconductor device.
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