发明名称 |
ZrBO FILM ETCHING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND ZrBO FILM ETCHING APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a ZrBO film etching method which can etching a ZrBO film, and provide a semiconductor device manufacturing method and a ZrBO film etching apparatus.SOLUTION: A semiconductor substrate comprises: a base material S having an upper side silicon substrate 43, in which a through hole H for forming an electrode piercing the upper side silicon substrate 43 is formed; and a ZrBO film 46 formed on an internal surface of the through hole H. A ZrBO film etching method comprises the step of supplying plasma generated from halogen-containing gas including fluorine-containing gas and non-fluorine halogen-containing gas to the ZrBO film 46. As a result, a bottom face ZrBO film 46b formed at least on a bottom face Hb of the through hole H is etched. |
申请公布号 |
JP2013219145(A) |
申请公布日期 |
2013.10.24 |
申请号 |
JP20120087636 |
申请日期 |
2012.04.06 |
申请人 |
ULVAC JAPAN LTD |
发明人 |
MORIKAWA YASUHIRO;MURAYAMA TAKAHIDE;HATANAKA MASANOBU;TOYODA SATOSHI;SU HIROTSUNA |
分类号 |
H01L21/3065;H01L21/3205;H01L21/768;H01L23/522;H05H1/46 |
主分类号 |
H01L21/3065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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