发明名称 EPITAXIAL SUBSTRATE FOR ELECTRONIC DEVICE USING TRANSVERSE DIRECTION AS DIRECTION OF CURRENT CONDUCTION AND MANUFACTURING METHOD THEREFOR
摘要 To provide an epitaxial substrate for electronic devices, in which current flows in a lateral direction, which enables accurate measurement of the sheet resistance of HEMTs without contact, and to provide a method of efficiently producing the epitaxial substrate for electronic devices, the method characteristically includes the steps of forming a barrier layer against impurity diffusion on one surface of a high-resistance Si-single crystal substrate, forming a buffer as an insulating layer on the other surface of the high-resistance Si-single crystal substrate, producing an epitaxial substrate by epitaxially growing a plurality of III-nitride layers on the buffer to form a main laminate, and measuring resistance of the main laminate of the epitaxial substrate without contact.
申请公布号 KR101321660(B1) 申请公布日期 2013.10.23
申请号 KR20127003108 申请日期 2010.07.13
申请人 发明人
分类号 H01L21/338;H01L29/778 主分类号 H01L21/338
代理机构 代理人
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