APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PURPOSE: An apparatus and method for manufacturing a semiconductor device are provided to increase the uniformity of a temperature by directly heating a substrate with infrared rays. CONSTITUTION: A wafer carrier (15) is prepared. A substrate (S) is mounted on the wafer carrier. A heating unit (17) is arranged on the lower surface of the wafer carrier. The heating unit heats the substrate with infrared rays. A nitride thin film is grown on the substrate.