POLISHING SLURRY AND METHOD OF POLISHING USING THE SAME
摘要
<p>Disclosed are a polishing slurry used in a polishing process of tungsten and a method of polishing using the same. The slurry includes an abrasive for performing polishing and an oxidation promoting agent for promoting the formation of an oxide. The abrasive includes titanium oxide particles.</p>
申请公布号
WO2013154236(A1)
申请公布日期
2013.10.17
申请号
WO2012KR07367
申请日期
2012.09.14
申请人
UBPRECISION CO., LTD.;PARK, JEA GUN;LEE, GON SUB;PARK, JIN HYUNG;LIM, JAE HYUNG;CHO, JONG YOUNG;HWANG, HEE SUB;CUI, HAO
发明人
PARK, JEA GUN;LEE, GON SUB;PARK, JIN HYUNG;LIM, JAE HYUNG;CHO, JONG YOUNG;HWANG, HEE SUB;CUI, HAO
