摘要 |
The present disclosure relates to a Chip on Board (COB) Light Emitting Diode ("LED") array assembly that incorporates refractive optics, an electrical connection to the LED array, an environmental sealing of the LED array and interior optical chamber, and which includes an anti wicking breaker on the electrical pass through, and which is sealed against a modular heat sink. The assembly is separately removable for field maintenance.
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