| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component loading device and an electronic component loading method, capable of preventing occurence of defective loading by accurately detecting height of an electronic component sucked by a sucking nozzle of a loading head before a substrate is loaded.SOLUTION: A component height measurement part includes a height measurement sensor which includes a projector for emitting light and a photosensor that receives light, for measuring a position of a lower end of an electronic component, and a height measurement control part which calculates height of the electronic component from information about a lower end position of the electronic component that is measured with the height measurement sensor and information about a lower end position of a sucking nozzle. The control part rotates the sucking nozzle to which the electronic component is sucked around the axis of the sucking nozzle at a measurement position of the height measurement sensor, and on the basis of a representative value of a position for each predetermined rotated angle, calculates height of the electronic component sucked by the sucking nozzle. |
