发明名称 |
RESIN COMPOSITION, AND PROTECTIVE FILM, DRY FILM, CIRCUIT BOARD, AND MULTILAYER CIRCUIT BOARD CONTAINING SAME |
摘要 |
A resin composition which is capable of forming a film that has excellent heat resistance and slidability/bendability; a protective film for circuits, which uses the resin composition; and a dry film or the like which comprises the protective film are provided. Other aspects are a circuit board and a multilayer circuit board, each of which has excellent heat resistance and slidability/bendability. Furthermore, a protective film for circuit boards is provided, which is arranged in contact with a circuit of a printed wiring board, and contains a polyoxazolidone resin that has a weight average molecular weight of 3×104 or more.
|
申请公布号 |
US2013269985(A1) |
申请公布日期 |
2013.10.17 |
申请号 |
US201113976630 |
申请日期 |
2011.12.26 |
申请人 |
TAHARA SHUJI;YASUDA KIYOMI;MITSUI CHEMICALS TOHCELLO, INC. |
发明人 |
TAHARA SHUJI;YASUDA KIYOMI |
分类号 |
H05K1/02 |
主分类号 |
H05K1/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|