| 摘要 |
PURPOSE: A chip on board type UV led module is provided to increase the focusing of a UV beam by using an encapsulation material made of a silicon resin. CONSTITUTION: An optical sheet (2) is bonded onto a circuit substrate. Sheet pieces are formed on a dam formation part (4). The sheet pieces are partially cut from the optical sheet. A UV LED chip (3) is mounted on the circuit substrate. An encapsulation material (5) made of a light transparence resin is formed within the dam formation part. |
