| 摘要 |
<p>A package structure of LED light source module comprises a metal substrate (1), a circuit board (2), reflective cups (3), and LED chips (4). The circuit board (2) is embedded in the lower surface of the metal substrate (1). At least one reflective cup (3) is on the upper face of the metal substrate (1). A pinhole (12) leading to the upper surface of the circuit board (2) is provided at the bottom of each reflective cup (3). At least one LED chip (4) is mounted in each of the reflective cups (3). The LED chips (4) are stuck on the portion of metal substrate (1) where the pinhole (12) does not exist at the bottom of the reflective cups (3) by insulating adhesive, and are connected to the circuit board (2) through wires (6) passing through the pinhole (12). A mixed layer (5) of glue and phosphor is coated on the upper surfaces of the LED chips (4).</p> |
